@inproceedings{kudalippalliyalil2022heterogeneously,
  title={Heterogeneously Integrated Quantum Chip Interposer Packaging},
  author={Kudalippalliyalil, Ramesh and Chandran, Sujith and Jaiswal, Akhilesh and Wang, Kang L and Jacob, Ajey P},
  booktitle={2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)},
  pages={1869--1874},
  year={2022},
  organization={IEEE}
}

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