Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications. Kumar, S., Greenslit, D., Chakraborty, T., & Eisenbraun, E. T. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 27(3):572--576, 2009. ![Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper bibtex @article{kumar_atomic_2009,
title = {Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications},
volume = {27},
url = {http://avs.scitation.org/doi/abs/10.1116/1.3122664},
number = {3},
urldate = {2017-04-22TZ},
journal = {Journal of Vacuum Science \& Technology A: Vacuum, Surfaces, and Films},
author = {Kumar, Sumit and Greenslit, Daniel and Chakraborty, Tonmoy and Eisenbraun, Eric T.},
year = {2009},
pages = {572--576}
}
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