Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers. Laurila, T, Hurtig, J, Vuorinen, V, & Kivilahti, J K Microelectronics Reliability, 49(3):242–247, March, 2009.
bibtex   
@article{laurila_effect_2009,
	title = {Effect of {Ag}, {Fe}, {Au} and {Ni} on the growth kinetics of {Sn}–{Cu} intermetallic compound layers},
	volume = {49},
	number = {3},
	journal = {Microelectronics Reliability},
	author = {Laurila, T and Hurtig, J and Vuorinen, V and Kivilahti, J K},
	month = mar,
	year = {2009},
	pages = {242--247},
}

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