High temperature tin-copper joints produced at low process temperature for stress reduction. Lee, C. C & Chen, Y. Thin Solid Films, 286(1-2):213–218, September, 1996. ![High temperature tin-copper joints produced at low process temperature for stress reduction [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi abstract bibtex A fluxlessbonding technique using Sn–Cumultilayercompositesto producehigh temperaturejoints at relatively low temperatureis presented.At a 280 °C processtemperature,joints whichwere almostvoid-free,with a meltingpointof 415 °C, weremade.Witha further annealing step, re-meltingtemperatureof the joints increasesto 713 °C. The technique,thus, gives a quantumjump to the post-processing temperatureof the componentsfabricated.As a resultof decreasedbondingtemperature,stressesin the fabricatedcomponentsare greatly reduced.SEM resultsclearlyshowthe microstru~..t,resof thejoints thatconsistof Cu6Snsand Cu~Snintermetallicphases,therebyverifying the proposedbondingprinciple.No fluxis requiredbecausetin oxidationis inhibitedin the fabricationprocesses.
@article{lee_high_1996,
title = {High temperature tin-copper joints produced at low process temperature for stress reduction},
volume = {286},
issn = {00406090},
url = {https://linkinghub.elsevier.com/retrieve/pii/S0040609095085025},
doi = {10.1016/S0040-6090(95)08502-5},
abstract = {A fluxlessbonding technique using Sn--Cumultilayercompositesto producehigh temperaturejoints at relatively low temperatureis presented.At a 280 °C processtemperature,joints whichwere almostvoid-free,with a meltingpointof 415 °C, weremade.Witha further annealing step, re-meltingtemperatureof the joints increasesto 713 °C. The technique,thus, gives a quantumjump to the post-processing temperatureof the componentsfabricated.As a resultof decreasedbondingtemperature,stressesin the fabricatedcomponentsare greatly reduced.SEM resultsclearlyshowthe microstru{\textasciitilde}..t,resof thejoints thatconsistof Cu6Snsand Cu{\textasciitilde}Snintermetallicphases,therebyverifying the proposedbondingprinciple.No fluxis requiredbecausetin oxidationis inhibitedin the fabricationprocesses.},
language = {en},
number = {1-2},
urldate = {2021-05-07},
journal = {Thin Solid Films},
author = {Lee, Chin C and Chen, Yi-Chia},
month = sep,
year = {1996},
pages = {213--218},
}
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