{"_id":"ELSDLM6WM3zAvjBxz","bibbaseid":"lee-chen-jao-liao-influenceofinterfacialintermetalliccompoundonfracturebehaviorofsolderjoints-2003","author_short":["Lee, H.","Chen, M.","Jao, H.","Liao, T."],"bibdata":{"bibtype":"article","type":"article","title":"Influence of interfacial intermetallic compound on fracture behavior of solder joints","volume":"358","number":"1-2","journal":"Materials Science and Engineering: A","author":[{"propositions":[],"lastnames":["Lee"],"firstnames":["Hwa-Teng"],"suffixes":[]},{"propositions":[],"lastnames":["Chen"],"firstnames":["Ming-Hung"],"suffixes":[]},{"propositions":[],"lastnames":["Jao"],"firstnames":["Huei-Mei"],"suffixes":[]},{"propositions":[],"lastnames":["Liao"],"firstnames":["Tain-Long"],"suffixes":[]}],"month":"October","year":"2003","pages":"134–141","bibtex":"@article{lee_influence_2003,\n\ttitle = {Influence of interfacial intermetallic compound on fracture behavior of solder joints},\n\tvolume = {358},\n\tnumber = {1-2},\n\tjournal = {Materials Science and Engineering: A},\n\tauthor = {Lee, Hwa-Teng and Chen, Ming-Hung and Jao, Huei-Mei and Liao, Tain-Long},\n\tmonth = oct,\n\tyear = {2003},\n\tpages = {134--141},\n}\n\n","author_short":["Lee, H.","Chen, M.","Jao, H.","Liao, T."],"key":"lee_influence_2003","id":"lee_influence_2003","bibbaseid":"lee-chen-jao-liao-influenceofinterfacialintermetalliccompoundonfracturebehaviorofsolderjoints-2003","role":"author","urls":{},"metadata":{"authorlinks":{}},"html":""},"bibtype":"article","biburl":"https://bibbase.org/zotero/pmanti","dataSources":["t4G55bmn46QNNuAWs"],"keywords":[],"search_terms":["influence","interfacial","intermetallic","compound","fracture","behavior","solder","joints","lee","chen","jao","liao"],"title":"Influence of interfacial intermetallic compound on fracture behavior of solder joints","year":2003}