Filament-to-filament joining of multi-filamentary Ag/Bi-2223 superconducting tapes. Lee, H., G., Kuk, I., H., Hong, G., W., Kim, E., A., No, K., S., & Goldacker, W. Physica C: Superconductivity and its Applications, 259(1-2):69-74, 1996.
abstract   bibtex   
Ag/Bi-2223 tape with 9 filaments, which were arranged checkerwise, was successfully fabricated by using square drawing dies. Filament-to-filament superconductive joint between multi-filamentary Ag/Bi-2223 tapes has been fabricated by using a combination of chemical, mechanical and thermal techniques. The joined area, fabricated with a load of 2 ton, showed > 75% current carrying capacity of the tapes without join-interface. Incomplete etching of silver sheath resulted in degradation of Ic at the joined area.
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 title = {Filament-to-filament joining of multi-filamentary Ag/Bi-2223 superconducting tapes},
 type = {article},
 year = {1996},
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 pages = {69-74},
 volume = {259},
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 abstract = {Ag/Bi-2223 tape with 9 filaments, which were arranged checkerwise, was successfully fabricated by using square drawing dies. Filament-to-filament superconductive joint between multi-filamentary Ag/Bi-2223 tapes has been fabricated by using a combination of chemical, mechanical and thermal techniques. The joined area, fabricated with a load of 2 ton, showed > 75% current carrying capacity of the tapes without join-interface. Incomplete etching of silver sheath resulted in degradation of Ic at the joined area.},
 bibtype = {article},
 author = {Lee, Hee Gyoun and Kuk, Il Hyun and Hong, Gye Won and Kim, Eon A. and No, Kwang Soo and Goldacker, Wilfried},
 journal = {Physica C: Superconductivity and its Applications},
 number = {1-2}
}
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