Study on Linear and Nonlinear Coupling Damage Model of BGA Solder Joint. Lei, D., Sun, Y., Qi, C., & Hu, W. IOP Conference Series: Materials Science and Engineering, 2019. ![Study on Linear and Nonlinear Coupling Damage Model of BGA Solder Joint [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper bibtex @article{2804,
author = {Dongyang Lei and Ye Sun and Chaojie Qi and Weiwei Hu},
title = {Study on Linear and Nonlinear Coupling Damage Model of BGA Solder Joint},
year = {2019},
journal = {IOP Conference Series: Materials Science and Engineering},
url = {https://doi.org/10.1088/1757-899x/685/1/012014}
}
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