@article{journals/tvlsi/LiJKM17,
  added-at = {2017-08-30T00:00:00.000+0200},
  author = {Li, Dawei and Joshi, Siddhartha and Kim, Ji-Hoon and Memik, Seda Ogrenci},
  biburl = {https://www.bibsonomy.org/bibtex/23a7325e060bd26faad18658db1af1320/dblp},
  ee = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2017.2699040},
  interhash = {da4b202df904aeed51a7c6f3fe005202},
  intrahash = {3a7325e060bd26faad18658db1af1320},
  journal = {IEEE Trans. VLSI Syst.},
  keywords = {dblp},
  number = 9,
  pages = {2498-2511},
  timestamp = {2017-08-31T11:37:07.000+0200},
  title = {End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs.},
  url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi25.html#LiJKM17},
  volume = 25,
  year = 2017
}

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