Physical Analysis of Data on Fused-Open Bond Wires. Loh, E. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 6(2):209–217, Institute of Electrical and Electronics Engineers (IEEE), June, 1983.
doi  bibtex   
@Article{         Loh_1983aa,
  author        = {Loh, E.},
  citable       = {1},
  doi           = {10.1109/tchmt.1983.1136162},
  file          = {Loh_1983aa.pdf},
  group         = {casper},
  internal      = {0},
  issn          = {0148-6411},
  journal       = {IEEE Transactions on Components, Hybrids, and Manufacturing Technology},
  keywords      = {bondwires,thermal,electronics,measurements},
  langid        = {english},
  month         = jun,
  number        = {2},
  pages         = {209--217},
  publisher     = {Institute of Electrical {and} Electronics Engineers ({IEEE})},
  title         = {Physical Analysis of Data on Fused-Open Bond Wires},
  volume        = {6},
  year          = {1983},
  shortjournal  = {IEEE Trans. Compon., Hybrids, and Manuf. Technol.}
}

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