Physical Analysis of Data on Fused-Open Bond Wires. Loh, E. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 6(2):209–217, Institute of Electrical and Electronics Engineers (IEEE), June, 1983. doi bibtex @Article{ Loh_1983aa,
author = {Loh, E.},
citable = {1},
doi = {10.1109/tchmt.1983.1136162},
file = {Loh_1983aa.pdf},
group = {casper},
internal = {0},
issn = {0148-6411},
journal = {IEEE Transactions on Components, Hybrids, and Manufacturing Technology},
keywords = {bondwires,thermal,electronics,measurements},
langid = {english},
month = jun,
number = {2},
pages = {209--217},
publisher = {Institute of Electrical {and} Electronics Engineers ({IEEE})},
title = {Physical Analysis of Data on Fused-Open Bond Wires},
volume = {6},
year = {1983},
shortjournal = {IEEE Trans. Compon., Hybrids, and Manuf. Technol.}
}
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