3D Optical Interconnects for High-Speed Interchip and Interboard Communications. Louri, A. & Sung, H. IEEE Computer, 27(10):27-37, 1994.
3D Optical Interconnects for High-Speed Interchip and Interboard Communications. [link]Link  3D Optical Interconnects for High-Speed Interchip and Interboard Communications. [link]Paper  bibtex   
@article{journals/computer/LouriS94,
  added-at = {2015-12-16T00:00:00.000+0100},
  author = {Louri, Ahmed and Sung, Hongki},
  biburl = {http://www.bibsonomy.org/bibtex/2b7154516e4079ea0ea726c24bb2e61f3/dblp},
  ee = {http://doi.ieeecomputersociety.org/10.1109/2.318581},
  interhash = {d91f35f0a2ce66a92edcc6aafadcbe1a},
  intrahash = {b7154516e4079ea0ea726c24bb2e61f3},
  journal = {IEEE Computer},
  keywords = {dblp},
  number = 10,
  pages = {27-37},
  timestamp = {2015-12-17T11:35:30.000+0100},
  title = {3D Optical Interconnects for High-Speed Interchip and Interboard Communications.},
  url = {http://dblp.uni-trier.de/db/journals/computer/computer27.html#LouriS94},
  volume = 27,
  year = 1994
}

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