Thermal-aware reliability analysis for platform FPGAs. Mangalagiri, P., Bae, S., Ramakrishnan, K., Xie, Y., & Narayanan, V. In Nassif, S. R. & Roychowdhury, J. S., editors, ICCAD, pages 722-727, 2008. IEEE Computer Society.
Thermal-aware reliability analysis for platform FPGAs. [link]Link  Thermal-aware reliability analysis for platform FPGAs. [link]Paper  bibtex   
@inproceedings{conf/iccad/MangalagiriBKXN08,
  added-at = {2015-05-01T00:00:00.000+0200},
  author = {Mangalagiri, Prasanth and Bae, Sungmin and Ramakrishnan, Krishnan and Xie, Yuan and Narayanan, Vijaykrishnan},
  biburl = {http://www.bibsonomy.org/bibtex/211b3bfa72dceb06e1527affc13d0ad97/dblp},
  booktitle = {ICCAD},
  crossref = {conf/iccad/2008},
  editor = {Nassif, Sani R. and Roychowdhury, Jaijeet S.},
  ee = {http://doi.acm.org/10.1145/1509456.1509613},
  interhash = {82decb11e4a3caaf603d8e966c489f5a},
  intrahash = {11b3bfa72dceb06e1527affc13d0ad97},
  isbn = {978-1-4244-2820-5},
  keywords = {dblp},
  pages = {722-727},
  publisher = {IEEE Computer Society},
  timestamp = {2015-06-18T23:15:13.000+0200},
  title = {Thermal-aware reliability analysis for platform FPGAs.},
  url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2008.html#MangalagiriBKXN08},
  year = 2008
}

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