@article{marin_enhancing_2015,
	title = {Enhancing the {Reactivity} of {Al}/{CuO} {Nanolaminates} by {Cu} {Incorporation} at the {Interfaces}},
	volume = {7},
	doi = {10.1021/acsami.5b02653},
	abstract = {In situ deposition of a thin (similar to 5 nm) layer of copper between Al and CuO layers is shown to increase the overall nanolaminate material reactivity. A combination of transmission electron microscopy imaging, in situ infrared spectroscopy, low energy ion scattering measurements, and first-principles calculations reveals that copper spontaneously diffuses into aluminum layers (substantially less in CuO layers). The formation of an interfacial Al:Cu alloy with melting temperature lower than pure Al metal is responsible for the enhanced reactivity, opening a route to controlling the stochiometry of the aluminum layer and increasing the reactivity of the nanoenergetic multilayer systems in general.},
	number = {22},
	journal = {Acs Applied Materials \& Interfaces},
	author = {Marin, Lorena and Nanayakkara, Charith E. and Veyan, Jean-Francois and Warot-Fonrose, Benedicte and Joulie, Sebastien and Esteve, Alain and Tenailleau, Christophe and Chabal, Yves J. and Rossi, Carole},
	month = jun,
	year = {2015},
	note = {WOS:000356316700002},
	pages = {11713--11718}
}

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