Method for assessing remaining life in electronic assemblies. McCluskey, F., Kweon, Y., Lee, H., Kim, J., & Jeon, H. Microelectronics Reliability, 40(2):293–306, February, 2000. ![Method for assessing remaining life in electronic assemblies [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi abstract bibtex A physics-of-failure based methodology is presented for determining the remaining life in electronic assemblies. The methodology has three steps. The ®rst step is to conduct an analysis of the degradation in electronic assemblies resulting from their storage or use, in order to determine the potential failure mechanisms. The second step is to use physics-of-failure models for these mechanisms to de®ne test conditions and durations that produce similar damage as that expected in the intended application but in a much shorter time. The third step is to perform these accelerated tests on used and unused assemblies and to conduct subsequent failure/degradation analysis of the tested assemblies. This third step provides the information needed to determine if the assembly has sucient life to survive in the intended application. This methodology is demonstrated by determining the remaining life of electronic assemblies operated intermittently in refrigerators. # 2000 Elsevier Science Ltd. All rights reserved.
@article{mccluskey_method_2000,
title = {Method for assessing remaining life in electronic assemblies},
volume = {40},
issn = {00262714},
url = {https://linkinghub.elsevier.com/retrieve/pii/S0026271499000827},
doi = {10.1016/S0026-2714(99)00082-7},
abstract = {A physics-of-failure based methodology is presented for determining the remaining life in electronic assemblies. The methodology has three steps. The ®rst step is to conduct an analysis of the degradation in electronic assemblies resulting from their storage or use, in order to determine the potential failure mechanisms. The second step is to use physics-of-failure models for these mechanisms to de®ne test conditions and durations that produce similar damage as that expected in the intended application but in a much shorter time. The third step is to perform these accelerated tests on used and unused assemblies and to conduct subsequent failure/degradation analysis of the tested assemblies. This third step provides the information needed to determine if the assembly has sucient life to survive in the intended application. This methodology is demonstrated by determining the remaining life of electronic assemblies operated intermittently in refrigerators. \# 2000 Elsevier Science Ltd. All rights reserved.},
language = {en},
number = {2},
urldate = {2021-05-07},
journal = {Microelectronics Reliability},
author = {McCluskey, F.P and Kweon, Y.D and Lee, H.J and Kim, J.W and Jeon, H.S},
month = feb,
year = {2000},
pages = {293--306},
}
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