@article{ journals/mr/MeinshausenFWP15, added-at = {2015-03-27T00:00:00.000+0100}, author = {Meinshausen, Lutz and Frémont, Hélène and Weide-Zaage, Kirsten and Plano, Bernard}, biburl = {http://www.bibsonomy.org/bibtex/21d34a5ed1618ba3db39efe3ced1df832/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2014.09.030}, interhash = {48e9e7d892e8919ff9fe52269ca725a6}, intrahash = {1d34a5ed1618ba3db39efe3ced1df832}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = {1}, pages = {192-200}, title = {Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#MeinshausenFWP15}, volume = {55}, year = {2015} }