FlexWAN: Software Hardware Co-design for Cost-Effective and Resilient Optical Backbones. Miao, C., Zhong, Z., Zhang, Y., He, K., Li, F., Chen, M., Zhao, Y., Li, X., He, Z., Zou, X., & Wang, J. In Schulzrinne, H., Misra, V., Kohler, E., & Maltz, D. A., editors, Proceedings of the ACM SIGCOMM 2023 Conference, ACM SIGCOMM 2023, New York, NY, USA, 10-14 September 2023, pages 319–332, 2023. ACM.
FlexWAN: Software Hardware Co-design for Cost-Effective and Resilient Optical Backbones [link]Paper  doi  bibtex   
@inproceedings{DBLP:conf/sigcomm/MiaoZ0HLCZLHZ023,
  author       = {Congcong Miao and
                  Zhizhen Zhong and
                  Ying Zhang and
                  Kunling He and
                  Fangchao Li and
                  Minggang Chen and
                  Yiren Zhao and
                  Xiang Li and
                  Zekun He and
                  Xianneng Zou and
                  Jilong Wang},
  editor       = {Henning Schulzrinne and
                  Vishal Misra and
                  Eddie Kohler and
                  David A. Maltz},
  title        = {FlexWAN: Software Hardware Co-design for Cost-Effective and Resilient
                  Optical Backbones},
  booktitle    = {Proceedings of the {ACM} {SIGCOMM} 2023 Conference, {ACM} {SIGCOMM}
                  2023, New York, NY, USA, 10-14 September 2023},
  pages        = {319--332},
  publisher    = {{ACM}},
  year         = {2023},
  url          = {https://doi.org/10.1145/3603269.3604824},
  doi          = {10.1145/3603269.3604824},
  timestamp    = {Sun, 19 Jan 2025 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/sigcomm/MiaoZ0HLCZLHZ023.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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