@article{journals/mr/PengKCKC06,
  added-at = {2020-02-22T00:00:00.000+0100},
  author = {Peng, Chih-Tang and Kuo, Chia-Tai and Chiang, Kuo-Ning and Ku, Terry and Chang, Kenny},
  biburl = {https://www.bibsonomy.org/bibtex/21852fbb2ed933828c8cc32a469ff82a1/dblp},
  ee = {https://doi.org/10.1016/j.microrel.2005.06.010},
  interhash = {9be817f4320927dbc17494806ba55a60},
  intrahash = {1852fbb2ed933828c8cc32a469ff82a1},
  journal = {Microelectron. Reliab.},
  keywords = {dblp},
  number = {2-4},
  pages = {523-534},
  timestamp = {2020-02-25T13:28:39.000+0100},
  title = {Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr46.html#PengKCKC06},
  volume = 46,
  year = 2006
}

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