@article{peng_effect_2007,
	title = {Effect of thermal aging on the interfacial structure of {SnAgCu} solder joints on {Cu}},
	volume = {47},
	number = {12},
	journal = {Microelectronics Reliability},
	author = {Peng, Weiqun and Monlevade, Eduardo and Marques, Marco E},
	month = dec,
	year = {2007},
	pages = {2161--2168},
}

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