@inproceedings{ dblp1993321,
  title = {Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects},
  author = {Hanhua Qian and Hao Liang and Chip-Hong Chang and Wei Zhang and Hao Yu},
  author_short = {Qian, H. and Liang, H. and Chang, C. and Zhang, W. and Yu, H.},
  bibtype = {inproceedings},
  type = {inproceedings},
  year = {2013},
  key = {dblp1993321},
  id = {dblp1993321},
  biburl = {http://www.dblp.org/rec/bibtex/conf/aspdac/QianLCZY13},
  url = {http://dx.doi.org/10.1109/ASPDAC.2013.6509643},
  conference = {ASP-DAC},
  pages = {485-490},
  text = {ASP-DAC 2013:485-490},
  booktitle = {Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC)}
}

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