Multiobjective optimal placement of convectively and conductively cooled electronic components on printed wiring boards. Queipo, N. & Gil, G. Journal of Electronic Packaging, 122(2):152--159, June, 2000.
bibtex   
@article{Queipo00,
  author = {N.V. Queipo and G.F. Gil},
  title = {{Multiobjective optimal placement of convectively and conductively
	cooled electronic components on printed wiring boards}},
  journal = {Journal of Electronic Packaging},
  volume = {122},
  number = {2},
  pages = {152--159},
  month = {June},
  year = {2000}
}
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