Die Stacking Technology for Terabit Chip-to-Chip Communications. Rahman, A.; Trezza, J.; New, B. J.; and Trimberger, S. In CICC, pages 587-590, 2006. IEEE.
Die Stacking Technology for Terabit Chip-to-Chip Communications. [link]Link  Die Stacking Technology for Terabit Chip-to-Chip Communications. [link]Paper  bibtex   
@inproceedings{ conf/cicc/RahmanTNT06,
  added-at = {2015-04-24T00:00:00.000+0200},
  author = {Rahman, Arifur and Trezza, John and New, Bernard J. and Trimberger, Stephen},
  biburl = {http://www.bibsonomy.org/bibtex/22f5e9ce820b2640db43869d7e420eff5/dblp},
  booktitle = {CICC},
  crossref = {conf/cicc/2006},
  ee = {http://dx.doi.org/10.1109/CICC.2006.320826},
  interhash = {07d7e65f036d0ea7ea4604eddb40595e},
  intrahash = {2f5e9ce820b2640db43869d7e420eff5},
  isbn = {1-4244-0075-9},
  keywords = {dblp},
  pages = {587-590},
  publisher = {IEEE},
  title = {Die Stacking Technology for Terabit Chip-to-Chip Communications.},
  url = {http://dblp.uni-trier.de/db/conf/cicc/cicc2006.html#RahmanTNT06},
  year = {2006}
}
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