A Power, Thermal and Reliability-Aware Network-on-Chip. Sharma, A., Gupta, Y., Yadav, S., Bhargava, L., Gaur, M. S., & Laxmi, V. In IEEE International Symposium on Nanoelectronic and Information Systems, iNIS 2017, Bhopal, India, December 18-20, 2017, pages 243–245, 2017. Paper doi bibtex @inproceedings{DBLP:conf/ises/0005GYBGL17,
author = {Ashish Sharma and
Yogendra Gupta and
Sonal Yadav and
Lava Bhargava and
Manoj Singh Gaur and
Vijay Laxmi},
title = {A Power, Thermal and Reliability-Aware Network-on-Chip},
booktitle = {{IEEE} International Symposium on Nanoelectronic and Information Systems,
iNIS 2017, Bhopal, India, December 18-20, 2017},
pages = {243--245},
year = {2017},
crossref = {DBLP:conf/ises/2017},
url = {https://doi.ieeecomputersociety.org/10.1109/iNIS.2017.55},
doi = {10.1109/INIS.2017.55},
timestamp = {Fri, 24 Mar 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/ises/0005GYBGL17.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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