A Power, Thermal and Reliability-Aware Network-on-Chip. Sharma, A., Gupta, Y., Yadav, S., Bhargava, L., Gaur, M. S., & Laxmi, V. In IEEE International Symposium on Nanoelectronic and Information Systems, iNIS 2017, Bhopal, India, December 18-20, 2017, pages 243–245, 2017.
A Power, Thermal and Reliability-Aware Network-on-Chip [link]Paper  doi  bibtex   
@inproceedings{DBLP:conf/ises/0005GYBGL17,
  author       = {Ashish Sharma and
                  Yogendra Gupta and
                  Sonal Yadav and
                  Lava Bhargava and
                  Manoj Singh Gaur and
                  Vijay Laxmi},
  title        = {A Power, Thermal and Reliability-Aware Network-on-Chip},
  booktitle    = {{IEEE} International Symposium on Nanoelectronic and Information Systems,
                  iNIS 2017, Bhopal, India, December 18-20, 2017},
  pages        = {243--245},
  year         = {2017},
  crossref     = {DBLP:conf/ises/2017},
  url          = {https://doi.ieeecomputersociety.org/10.1109/iNIS.2017.55},
  doi          = {10.1109/INIS.2017.55},
  timestamp    = {Fri, 24 Mar 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/ises/0005GYBGL17.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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