@article{journals/mr/ShiPZ04,
  added-at = {2016-01-06T00:00:00.000+0100},
  author = {Shi, X. Q. and Pang, John H. L. and Zhang, X. R.},
  biburl = {http://www.bibsonomy.org/bibtex/235c9ba1cde8a16ac5d0a7ee1d17cfa12/dblp},
  ee = {http://dx.doi.org/10.1016/j.microrel.2003.12.001},
  interhash = {f4f1e3510e9a9aed162b67c4c34524cb},
  intrahash = {35c9ba1cde8a16ac5d0a7ee1d17cfa12},
  journal = {Microelectronics Reliability},
  keywords = {dblp},
  number = 5,
  pages = {841-852},
  timestamp = {2016-01-07T11:36:52.000+0100},
  title = {Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr44.html#ShiPZ04},
  volume = 44,
  year = 2004
}

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