Wafer Scale Graphene Transfer for Back End of the Line Device Integration. Smith, A., D., Vaziri, S., Rodriguez, S., Ostling, M., & Lemme, M., C. In Proc. IEEE International Conference on Ultimate Integration on Silicon (ULIS), 2014.
bibtex   
@inProceedings{
 title = {Wafer Scale Graphene Transfer for Back End of the Line Device Integration},
 type = {inProceedings},
 year = {2014},
 id = {161be6d2-f2e3-39b4-8be3-1067df02571f},
 created = {2018-11-02T20:28:08.332Z},
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 last_modified = {2018-11-02T20:28:08.332Z},
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 citation_key = {Smith2014},
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 bibtype = {inProceedings},
 author = {Smith, A. D. and Vaziri, Sam and Rodriguez, Saul and Ostling, Mikael and Lemme, Max C},
 booktitle = {Proc. IEEE International Conference on Ultimate Integration on Silicon (ULIS)}
}

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