@inproceedings{conf/imw2/SpessotSERXBLCB22,
  added-at = {2025-06-05T00:00:00.000+0200},
  author = {Spessot, Alessio and Salahuddin, Shairfe Muhammad and Escobar, Ricardo and Ritzenthaler, Romain and Xiang, Yang and Budhwani, Rahul and Litta, Eugenio Dentoni and Capogreco, Elena and Bastos, Joao P. and Chen, Yangyin and Horiguchi, Naoto},
  biburl = {https://www.bibsonomy.org/bibtex/29f964a51c3c3a8145c8e9cc68df7bb85/dblp},
  booktitle = {IMW},
  crossref = {conf/imw2/2022},
  ee = {https://doi.org/10.1109/IMW52921.2022.9779308},
  interhash = {43825e455b62949e94f75ca206633753},
  intrahash = {9f964a51c3c3a8145c8e9cc68df7bb85},
  isbn = {978-1-6654-9947-7},
  keywords = {dblp},
  pages = {1-4},
  publisher = {IEEE},
  timestamp = {2025-06-09T07:08:12.000+0200},
  title = {Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations.},
  url = {http://dblp.uni-trier.de/db/conf/imw2/imw2022.html#SpessotSERXBLCB22},
  year = 2022
}

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