Pinned to the walls: impact of packaging and application properties on the memory and power walls. Stanley-Marbell, P., Cabezas, V. C., & Luijten, R. P. In Chang, N., Nakamura, H., Inoue, K., Osada, K., & Poncino, M., editors, Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011, Fukuoka, Japan, August 1-3, 2011, pages 51–56, 2011. IEEE/ACM.
Paper bibtex @inproceedings{DBLP:conf/islped/Stanley-MarbellCL11,
author = {Phillip Stanley{-}Marbell and
Victoria Caparr{\'{o}}s Cabezas and
Ronald P. Luijten},
editor = {Naehyuck Chang and
Hiroshi Nakamura and
Koji Inoue and
Kenichi Osada and
Massimo Poncino},
title = {Pinned to the walls: impact of packaging and application properties
on the memory and power walls},
booktitle = {Proceedings of the 2011 International Symposium on Low Power Electronics
and Design, 2011, Fukuoka, Japan, August 1-3, 2011},
pages = {51--56},
publisher = {{IEEE/ACM}},
year = {2011},
url = {http://portal.acm.org/citation.cfm?id=2016815\&\#38;CFID=34981777\&\#38;CFTOKEN=25607807},
timestamp = {Mon, 13 Aug 2012 09:40:34 +0200},
biburl = {https://dblp.org/rec/conf/islped/Stanley-MarbellCL11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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