Pinned to the walls: impact of packaging and application properties on the memory and power walls. Stanley-Marbell, P., Cabezas, V. C., & Luijten, R. P. In Chang, N., Nakamura, H., Inoue, K., Osada, K., & Poncino, M., editors, Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011, Fukuoka, Japan, August 1-3, 2011, pages 51–56, 2011. IEEE/ACM.
Pinned to the walls: impact of packaging and application properties on the memory and power walls [link]Paper  bibtex   
@inproceedings{DBLP:conf/islped/Stanley-MarbellCL11,
  author       = {Phillip Stanley{-}Marbell and
                  Victoria Caparr{\'{o}}s Cabezas and
                  Ronald P. Luijten},
  editor       = {Naehyuck Chang and
                  Hiroshi Nakamura and
                  Koji Inoue and
                  Kenichi Osada and
                  Massimo Poncino},
  title        = {Pinned to the walls: impact of packaging and application properties
                  on the memory and power walls},
  booktitle    = {Proceedings of the 2011 International Symposium on Low Power Electronics
                  and Design, 2011, Fukuoka, Japan, August 1-3, 2011},
  pages        = {51--56},
  publisher    = {{IEEE/ACM}},
  year         = {2011},
  url          = {http://portal.acm.org/citation.cfm?id=2016815\&\#38;CFID=34981777\&\#38;CFTOKEN=25607807},
  timestamp    = {Mon, 13 Aug 2012 09:40:34 +0200},
  biburl       = {https://dblp.org/rec/conf/islped/Stanley-MarbellCL11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

Downloads: 0