Balanced nanocomposite thermosetting materials for HVDC and AC applications. Stevens, G., C., Freebody, N., A., Vaughan, A., S., Virtanen, S., Hyde, A., Perrot, F., Szkoda-Giannaki, I., Baker, P., Bon, S., A., Coles, S., R., & Medlam, J., A. In 33rd Electrical Insulation Conference, EIC 2015, pages 193-196, 2015.
Balanced nanocomposite thermosetting materials for HVDC and AC applications [link]Website  doi  abstract   bibtex   2 downloads  
Email Print Request Permissions There is a need to develop materials with controlled electrical resistivity, reduced space charge accumulation, higher thermal conductivity, higher dielectric strength and enhanced voltage endurance to cope with DC stresses in High Voltage Direct Current (HVDC) transmission systems in addition to HVAC requirements. If the balance of properties, performance and process requirements are achieved this may lead to HVDC insulation systems and equipment having a reduced footprint, larger power densities, and greater multi-stress resilience with longer service lifetimes. It reports findings of a project that is engaging this challenge and investigates the development and scaling of new thermoset based nanocomposite electrical insulation materials for HVDC power transmission applications. Some of the results such as increased electrical breakdown strength and reduced electrical conductivity for reactively surface functionalised nanosilica, and increased thermal conductivity for nano boron nitride and their significance in regard to the wider application of these electrical insulation materials are also discussed. With sufficient understanding of these properties, their trade-offs and process requirements it is possible to tailor balanced materials for specific use in HVAC or HVDC components.
@inproceedings{
 title = {Balanced nanocomposite thermosetting materials for HVDC and AC applications},
 type = {inproceedings},
 year = {2015},
 keywords = {Epoxy Resin,HVA C,HVDC,Nanocomposite,Nanodielectric,Power Transmission},
 pages = {193-196},
 websites = {http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=7223516&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D7223516},
 institution = {IEEE},
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 created = {2024-01-02T14:09:38.354Z},
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 last_modified = {2024-01-02T14:09:38.354Z},
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 authored = {false},
 confirmed = {true},
 hidden = {false},
 citation_key = {stevens2015balanced},
 source_type = {inproceedings},
 private_publication = {false},
 abstract = {Email Print Request Permissions There is a need to develop materials with controlled electrical resistivity, reduced space charge accumulation, higher thermal conductivity, higher dielectric strength and enhanced voltage endurance to cope with DC stresses in High Voltage Direct Current (HVDC) transmission systems in addition to HVAC requirements. If the balance of properties, performance and process requirements are achieved this may lead to HVDC insulation systems and equipment having a reduced footprint, larger power densities, and greater multi-stress resilience with longer service lifetimes. It reports findings of a project that is engaging this challenge and investigates the development and scaling of new thermoset based nanocomposite electrical insulation materials for HVDC power transmission applications. Some of the results such as increased electrical breakdown strength and reduced electrical conductivity for reactively surface functionalised nanosilica, and increased thermal conductivity for nano boron nitride and their significance in regard to the wider application of these electrical insulation materials are also discussed. With sufficient understanding of these properties, their trade-offs and process requirements it is possible to tailor balanced materials for specific use in HVAC or HVDC components.},
 bibtype = {inproceedings},
 author = {Stevens, G. C. and Freebody, N. A. and Vaughan, A. S. and Virtanen, S. and Hyde, A. and Perrot, F. and Szkoda-Giannaki, I. and Baker, P. and Bon, S. A.F. and Coles, S. R. and Medlam, J. A.},
 doi = {10.1109/ICACACT.2014.7223516},
 booktitle = {33rd Electrical Insulation Conference, EIC 2015}
}
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