Towards Hard And Soft Packaging for Die-Scale ICs. Teng, L., Zirhli, O., Ustbas, B., & Sezer, D. In MicroTech, pages 2-3, 2016. bibtex @inProceedings{
title = {Towards Hard And Soft Packaging for Die-Scale ICs},
type = {inProceedings},
year = {2016},
identifiers = {[object Object]},
pages = {2-3},
issue = {March},
id = {29e456ca-b140-3919-bfa3-f7e8a583021c},
created = {2019-06-11T10:30:33.763Z},
file_attached = {false},
profile_id = {5edad8f2-862b-3790-9737-12f44f0230e7},
group_id = {20f5abe8-c5b0-3e6e-bb82-3afee3d204f6},
last_modified = {2019-06-11T10:30:33.763Z},
read = {false},
starred = {false},
authored = {false},
confirmed = {false},
hidden = {false},
private_publication = {false},
bibtype = {inProceedings},
author = {Teng, Lijun and Zirhli, Onur and Ustbas, Burcin and Sezer, Dilek},
booktitle = {MicroTech}
}
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{"_id":"qCs8Ag7qLuLwqk6Wd","bibbaseid":"teng-zirhli-ustbas-sezer-towardshardandsoftpackagingfordiescaleics-2016","authorIDs":["5cff85cc4d1fd3da01000147"],"author_short":["Teng, L.","Zirhli, O.","Ustbas, B.","Sezer, D."],"bibdata":{"title":"Towards Hard And Soft Packaging for Die-Scale ICs","type":"inProceedings","year":"2016","identifiers":"[object Object]","pages":"2-3","issue":"March","id":"29e456ca-b140-3919-bfa3-f7e8a583021c","created":"2019-06-11T10:30:33.763Z","file_attached":false,"profile_id":"5edad8f2-862b-3790-9737-12f44f0230e7","group_id":"20f5abe8-c5b0-3e6e-bb82-3afee3d204f6","last_modified":"2019-06-11T10:30:33.763Z","read":false,"starred":false,"authored":false,"confirmed":false,"hidden":false,"private_publication":false,"bibtype":"inProceedings","author":"Teng, Lijun and Zirhli, Onur and Ustbas, Burcin and Sezer, Dilek","booktitle":"MicroTech","bibtex":"@inProceedings{\n title = {Towards Hard And Soft Packaging for Die-Scale ICs},\n type = {inProceedings},\n year = {2016},\n identifiers = {[object Object]},\n pages = {2-3},\n issue = {March},\n id = {29e456ca-b140-3919-bfa3-f7e8a583021c},\n created = {2019-06-11T10:30:33.763Z},\n file_attached = {false},\n profile_id = {5edad8f2-862b-3790-9737-12f44f0230e7},\n group_id = {20f5abe8-c5b0-3e6e-bb82-3afee3d204f6},\n last_modified = {2019-06-11T10:30:33.763Z},\n read = {false},\n starred = {false},\n authored = {false},\n confirmed = {false},\n hidden = {false},\n private_publication = {false},\n bibtype = {inProceedings},\n author = {Teng, Lijun and Zirhli, Onur and Ustbas, Burcin and Sezer, Dilek},\n booktitle = {MicroTech}\n}","author_short":["Teng, L.","Zirhli, O.","Ustbas, B.","Sezer, D."],"bibbaseid":"teng-zirhli-ustbas-sezer-towardshardandsoftpackagingfordiescaleics-2016","role":"author","urls":{},"downloads":0},"bibtype":"inProceedings","creationDate":"2019-06-11T10:43:24.437Z","downloads":0,"keywords":[],"search_terms":["towards","hard","soft","packaging","die","scale","ics","teng","zirhli","ustbas","sezer"],"title":"Towards Hard And Soft Packaging for Die-Scale ICs","year":2016}