Towards Hard And Soft Packaging for Die-Scale ICs. Teng, L., Zirhli, O., Ustbas, B., & Sezer, D. In MicroTech, pages 2-3, 2016.
bibtex   
@inProceedings{
 title = {Towards Hard And Soft Packaging for Die-Scale ICs},
 type = {inProceedings},
 year = {2016},
 identifiers = {[object Object]},
 pages = {2-3},
 issue = {March},
 id = {29e456ca-b140-3919-bfa3-f7e8a583021c},
 created = {2019-06-11T10:30:33.763Z},
 file_attached = {false},
 profile_id = {5edad8f2-862b-3790-9737-12f44f0230e7},
 group_id = {20f5abe8-c5b0-3e6e-bb82-3afee3d204f6},
 last_modified = {2019-06-11T10:30:33.763Z},
 read = {false},
 starred = {false},
 authored = {false},
 confirmed = {false},
 hidden = {false},
 private_publication = {false},
 bibtype = {inProceedings},
 author = {Teng, Lijun and Zirhli, Onur and Ustbas, Burcin and Sezer, Dilek},
 booktitle = {MicroTech}
}

Downloads: 0