Benchmarking and Testing of Qualcomm Snapdragon System-on-Chip for JPL Space Applications and Missions. Towfic, Z., Ogbe, D., Sauvageau, J., Sheldon, D., Jongeling, A., Chien, S., Mirza, F., Dunkel, E., Swope, J., Ogut, M., Cretu, V., & Pagnotta, C. In 2022 IEEE Aerospace Conference (AERO), pages 1-12, 2022.
doi  bibtex   
@inproceedings{towfic-ieee-aero-2022,
author={Towfic, Zaid and Ogbe, Dennis and Sauvageau, Joe and Sheldon, Douglas and Jongeling, Andre and Chien, Steve and Mirza, Faiz and Dunkel, Emily and Swope, Jason and Ogut, Mehmet and Cretu, Vlad and Pagnotta, Chris},
booktitle={2022 IEEE Aerospace Conference (AERO)},
title={Benchmarking and Testing of Qualcomm Snapdragon System-on-Chip for JPL Space Applications and Missions},
year={2022},
volume={},
number={},
pages={1-12},
doi={10.1109/AERO53065.2022.9843518}}

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