Effects of Cr dopant on the microstructure and electromigration performance of Cu interconnects. Wang, X., Dong, X., & Wu, J. Applied Surface Science, 255(22):9273–9278, August, 2009.
bibtex   
@article{wang_effects_2009,
	title = {Effects of {Cr} dopant on the microstructure and electromigration performance of {Cu} interconnects},
	volume = {255},
	number = {22},
	journal = {Applied Surface Science},
	author = {Wang, Xinjian and Dong, Xianping and Wu, Jiansheng},
	month = aug,
	year = {2009},
	pages = {9273--9278},
}

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