Influences of Ta passivation layers on the fatigue behavior of thin Cu films. Wang, D., Gruber, P. A., Volkert, C. A., & Kraft, O. Materials Science and Engineering: A, 610:33–38, Elsevier BV, 2014. ![Influences of Ta passivation layers on the fatigue behavior of thin Cu films [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi bibtex @article{10.1016/j.msea.2014.05.024,
doi = {10.1016/j.msea.2014.05.024},
url = {http://dx.doi.org/10.1016/j.msea.2014.05.024},
year = 2014,
publisher = {Elsevier {BV}},
volume = {610},
pages = {33--38},
author = {Dong Wang and Patric A. Gruber and Cynthia A. Volkert and Oliver Kraft},
title = {Influences of Ta passivation layers on the fatigue behavior of thin Cu films},
journal = {Materials Science and Engineering: A}
}
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