{"_id":"687bsio4zv6yWpQyB","bibbaseid":"wang-lin-kao-kirkendallvoidsformationinthereactionbetweennidopedsnagleadfreesoldersanddifferentcusubstrates-2009","author_short":["Wang, Y W","Lin, Y W","Kao, C R"],"bibdata":{"bibtype":"article","type":"article","title":"Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates","volume":"49","number":"3","journal":"Microelectronics Reliability","author":[{"propositions":[],"lastnames":["Wang"],"firstnames":["Y","W"],"suffixes":[]},{"propositions":[],"lastnames":["Lin"],"firstnames":["Y","W"],"suffixes":[]},{"propositions":[],"lastnames":["Kao"],"firstnames":["C","R"],"suffixes":[]}],"month":"March","year":"2009","pages":"248–252","bibtex":"@article{wang_kirkendall_2009,\n\ttitle = {Kirkendall voids formation in the reaction between {Ni}-doped {SnAg} lead-free solders and different {Cu} substrates},\n\tvolume = {49},\n\tnumber = {3},\n\tjournal = {Microelectronics Reliability},\n\tauthor = {Wang, Y W and Lin, Y W and Kao, C R},\n\tmonth = mar,\n\tyear = {2009},\n\tpages = {248--252},\n}\n\n","author_short":["Wang, Y W","Lin, Y W","Kao, C R"],"key":"wang_kirkendall_2009","id":"wang_kirkendall_2009","bibbaseid":"wang-lin-kao-kirkendallvoidsformationinthereactionbetweennidopedsnagleadfreesoldersanddifferentcusubstrates-2009","role":"author","urls":{},"metadata":{"authorlinks":{}},"html":""},"bibtype":"article","biburl":"https://bibbase.org/zotero/pmanti","dataSources":["t4G55bmn46QNNuAWs"],"keywords":[],"search_terms":["kirkendall","voids","formation","reaction","between","doped","snag","lead","free","solders","different","substrates","wang","lin","kao"],"title":"Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates","year":2009}