Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor. Wong, O., Tam, W., Shea, O., Cheung, S. H., Liu, J., Kok, C., & Wong, H. Microelectronics Reliability, 49(5):506-509, 2009.
Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor. [link]Link  Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor. [link]Paper  bibtex   
@article{journals/mr/WongTSCLKW09,
  added-at = {2010-09-29T00:00:00.000+0200},
  author = {Wong, Oi-Ying and Tam, Wing-Shan and Shea, Oi-Kan and Cheung, Shiu Hung and Liu, Jun and Kok, Chi-Wah and Wong, Hei},
  biburl = {http://www.bibsonomy.org/bibtex/20877a6a3aa55a8e3032a69b6bba7ff36/dblp},
  ee = {http://dx.doi.org/10.1016/j.microrel.2009.02.022},
  interhash = {7f879afadf7a22f5987cf4b04627cff6},
  intrahash = {0877a6a3aa55a8e3032a69b6bba7ff36},
  journal = {Microelectronics Reliability},
  keywords = {dblp},
  number = 5,
  pages = {506-509},
  timestamp = {2010-09-30T11:32:24.000+0200},
  title = {Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor.},
  url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#WongTSCLKW09},
  volume = 49,
  year = 2009
}

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