Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor. Wong, O., Tam, W., Shea, O., Cheung, S. H., Liu, J., Kok, C., & Wong, H. Microelectronics Reliability, 49(5):506-509, 2009.
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Paper bibtex @article{journals/mr/WongTSCLKW09,
added-at = {2010-09-29T00:00:00.000+0200},
author = {Wong, Oi-Ying and Tam, Wing-Shan and Shea, Oi-Kan and Cheung, Shiu Hung and Liu, Jun and Kok, Chi-Wah and Wong, Hei},
biburl = {http://www.bibsonomy.org/bibtex/20877a6a3aa55a8e3032a69b6bba7ff36/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2009.02.022},
interhash = {7f879afadf7a22f5987cf4b04627cff6},
intrahash = {0877a6a3aa55a8e3032a69b6bba7ff36},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = 5,
pages = {506-509},
timestamp = {2010-09-30T11:32:24.000+0200},
title = {Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#WongTSCLKW09},
volume = 49,
year = 2009
}
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