A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending. Xu, L., Reinikainen, T., Ren, W., Wang, B. P., Han, Z., & Agonafer, D. Microelectron. Reliab., 44(12):1977–1983, 2004.
Paper doi bibtex @article{DBLP:journals/mr/XuRRWHA04,
author = {Leon Xu and
Tommi Reinikainen and
Wei Ren and
Bo Ping Wang and
Zhenxue Han and
Dereje Agonafer},
title = {A simulation-based multi-objective design optimization of electronic
packages under thermal cycling and bending},
journal = {Microelectron. Reliab.},
volume = {44},
number = {12},
pages = {1977--1983},
year = {2004},
url = {https://doi.org/10.1016/j.microrel.2004.04.024},
doi = {10.1016/j.microrel.2004.04.024},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/XuRRWHA04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
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