A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending. Xu, L., Reinikainen, T., Ren, W., Wang, B. P., Han, Z., & Agonafer, D. Microelectron. Reliab., 44(12):1977–1983, 2004.
A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending [link]Paper  doi  bibtex   
@article{DBLP:journals/mr/XuRRWHA04,
  author    = {Leon Xu and
               Tommi Reinikainen and
               Wei Ren and
               Bo Ping Wang and
               Zhenxue Han and
               Dereje Agonafer},
  title     = {A simulation-based multi-objective design optimization of electronic
               packages under thermal cycling and bending},
  journal   = {Microelectron. Reliab.},
  volume    = {44},
  number    = {12},
  pages     = {1977--1983},
  year      = {2004},
  url       = {https://doi.org/10.1016/j.microrel.2004.04.024},
  doi       = {10.1016/j.microrel.2004.04.024},
  timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/XuRRWHA04.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}

Downloads: 0