0.6-to-1.0 V 279μm 2, 0.92μW temperature sensor with less than+ 3.2/-3.4° C error for on-chip dense thermal monitoring. Yang, T., Kim, S., Kinget, P. R., & Seok, M. In 2014 IEEE International Solid-State Circuits Conference (ISSCC), pages 282–283, 2014. IEEE. ![0.6-to-1.0 V 279μm 2, 0.92μW temperature sensor with less than+ 3.2/-3.4° C error for on-chip dense thermal monitoring [link]](https://bibbase.org/img/filetypes/link.svg "link")
Paper doi bibtex @inproceedings{yang_0.6--1.0_2014,
title = {0.6-to-1.0 {V} 279μm 2, 0.92{μW} temperature sensor with less than+ 3.2/-3.4° {C} error for on-chip dense thermal monitoring},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6757435},
doi = {10.1109/ISSCC.2014.6757435},
urldate = {2015-01-29TZ},
booktitle = {2014 {IEEE} {International} {Solid}-{State} {Circuits} {Conference} ({ISSCC})},
publisher = {IEEE},
author = {Yang, Teng and Kim, Seongjong and Kinget, Peter R. and Seok, Mingoo},
year = {2014},
pages = {282--283}
}
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