Design Considerations for 3D Heterogeneous Integration Driven Analog Processing-in-Pixel for Extreme-Edge Intelligence. Yin, Z., Datta, G., Kaiser, M. A., Beerel, P., Jacob, A., & Jaiswal, A. In 2023 IEEE International Conference on Rebooting Computing (ICRC), pages 1-5, 2023. doi bibtex @INPROCEEDINGS{10386206,
author={Yin, Zihan and Datta, Gourav and Kaiser, Md Abdullah-Al and Beerel, Peter and Jacob, Ajey and Jaiswal, Akhilesh},
booktitle={2023 IEEE International Conference on Rebooting Computing (ICRC)},
title={Design Considerations for 3D Heterogeneous Integration Driven Analog Processing-in-Pixel for Extreme-Edge Intelligence},
year={2023},
volume={},
number={},
pages={1-5},
keywords={Computer vision;Three-dimensional displays;Multichip modules;CMOS image sensors;Data processing;Trajectory;Circuit synthesis;3D integration;in-pixel computing;edge computing;CMOS image sensors;Cu–Cu connections},
doi={10.1109/ICRC60800.2023.10386206}}
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