Random walk based capacitance extraction for 3D ICs with cylindrical inter-tier-vias. Yu, W., Zhang, C., Wang, Q., & Shi, Y. In Proceedings of International Conference on Computer Aided Design (ICCAD), pages 702-709, 2014.
Random walk based capacitance extraction for 3D ICs with cylindrical inter-tier-vias [link]Paper  bibtex   
@inproceedings{ dblp1889821,
  title = {Random walk based capacitance extraction for 3D ICs with cylindrical inter-tier-vias},
  author = {Wenjian Yu and Chao Zhang and Qing Wang and Yiyu Shi},
  author_short = {Yu, W. and Zhang, C. and Wang, Q. and Shi, Y.},
  bibtype = {inproceedings},
  type = {inproceedings},
  year = {2014},
  key = {dblp1889821},
  id = {dblp1889821},
  biburl = {http://www.dblp.org/rec/bibtex/conf/iccad/YuZWS14},
  url = {http://dx.doi.org/10.1109/ICCAD.2014.7001429},
  conference = {ICCAD},
  pages = {702-709},
  text = {ICCAD 2014:702-709},
  booktitle = {Proceedings of International Conference on Computer Aided Design (ICCAD)}
}

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