@article{
 title = {Challenges and future perspectives},
 type = {article},
 year = {2006},
 identifiers = {[object Object]},
 keywords = {Mechanics,Modelling,Molecular dynamics,Multi-physics,Multi-scale,Simulation},
 pages = {537-563},
 volume = {141},
 id = {5e71ef0f-d1fc-3b3e-8468-e712afd233ba},
 created = {2020-02-05T01:22:59.516Z},
 accessed = {2020-02-04},
 file_attached = {false},
 profile_id = {66be748e-b1e3-36e1-95e1-5830d0ccc3ca},
 group_id = {ed1fa25d-c56b-3067-962d-9d08ff49394c},
 last_modified = {2020-02-05T01:22:59.926Z},
 read = {false},
 starred = {false},
 authored = {false},
 confirmed = {false},
 hidden = {false},
 folder_uuids = {c2955262-615e-4e71-ba11-ca23b3748d20},
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 abstract = {The combination of technology and business trends drives microelectronic technologies into an unknown level of complexity, characterized by ongoing miniaturization down to nano-scale, heterogeneous and multi-functionality, multi-discipline, multi-scale (in both geometry and time), multi-technology, multi-process, multi-material/interface, multi-damage and multi-failure mode. As the consequences, industries are confronted with ever increased design complexity, dramatically decreased design margins, increased chances and consequences of failures, decreased product development and qualification times, increased gap between technology advance and development of fundamental knowledge, and increased difficulties to meet quality, robustness, and reliability requirements. In this chapter, the mechanical related characteristics of microelectronics are summarized and the challenges and future perspectives for mechanics of microelectronics are highlighted, as an attempt to guide the future developments and exploitation of mechanics for microelectronics.},
 bibtype = {article},
 author = {Zhang, G. Q.},
 journal = {Solid Mechanics and its Applications}
}

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