On-Chip versus Off-Chip Passives in Radio and Mixed-Signal System-on-Package Design. Zheng, L.; Duo, X.; Nejad, M.; Rodriguez, S.; Ismail, M.; and Tenhunen, H. In Proc. of IEEE Conference on Electronics System integration Technology, pages 221-232, 2006.
bibtex   
@inProceedings{
 title = {On-Chip versus Off-Chip Passives in Radio and Mixed-Signal System-on-Package Design},
 type = {inProceedings},
 year = {2006},
 pages = {221-232},
 id = {61cf0435-7eff-360f-916f-40b7877e7258},
 created = {2018-11-02T20:28:09.999Z},
 file_attached = {false},
 profile_id = {99d7e05e-a704-3549-ada2-dfc74a2d55ec},
 group_id = {12f05641-c77a-31e5-8cbb-fca8e3a2be03},
 last_modified = {2018-11-02T20:28:09.999Z},
 read = {false},
 starred = {false},
 authored = {false},
 confirmed = {true},
 hidden = {false},
 citation_key = {Zheng2006c},
 private_publication = {false},
 bibtype = {inProceedings},
 author = {Zheng, L-R. and Duo, X. and Nejad, M.B. and Rodriguez, S. and Ismail, M. and Tenhunen, H.},
 booktitle = {Proc. of IEEE Conference on Electronics System integration Technology}
}
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