System-on-flexible-substrates: electronics for future smart-intelligent world. Zheng, L., Nejad, M., Rodriguez, S., Zhang, L., Chen, C., & Tenhunen, H. In Proc. of IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, pages 29-36, 2006.
bibtex   
@inProceedings{
 title = {System-on-flexible-substrates: electronics for future smart-intelligent world},
 type = {inProceedings},
 year = {2006},
 pages = {29-36},
 id = {ee6e0003-a470-335f-a3a9-10e430836245},
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 last_modified = {2018-11-02T20:28:08.826Z},
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 citation_key = {Zheng2006b},
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 bibtype = {inProceedings},
 author = {Zheng, L-R. and Nejad, M.B. and Rodriguez, S. and Zhang, L. and Chen, C. and Tenhunen, H.},
 booktitle = {Proc. of IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis}
}

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